SHINKO ELECTRIC INDUSTRIES CO., LTD. Receives Best of Symposium, including Best of Track, at IMAPS Symposium 2025

SHINKO ELECTRIC INDUSTRIES CO., LTD. received both the “Best of Symposium” and “Best of Track for RF, MEMS/Sensors, High Rel, WLCSP, Small Body FO, SiP Structures Track” awards at the IMAPS Symposium 2025 (58th International Symposium on Microelectronics), held in San Diego, California, USA, from September 29 to October 2, 2025.
These honors reflect the high recognition of our research on Antenna-in-Package (AiP) structures for terahertz wireless LAN. Our paper was selected as the “Best of Track,” representing the most outstanding work within the RF (Radio Frequency), MEMS (Micro Electro Mechanical Systems)/Sensors, High Rel (High Reliability), WLCSP (Wafer Level Chip Scale Package), Small Body FO (Fan-Out), SiP (System in Package) Structures track. Furthermore, from the five “Best of Track” awards at the IMAPS Symposium 2025, it was also selected for the “Best of Symposium” award, which is given to the most outstanding paper.

Title of a Conference Presentation

150 GHz-band Coreless High Multilayer Antenna-in-Package for 6G

Abstract for a Conference Presentation

In recent years, our daily lives have been filled with data exchange at communication terminals everywhere, and the development of low-latency communication technologies for use in medical equipment, factory automation, autonomous driving, and other applications has been gaining momentum. The terahertz wave, a new frequency band, is expected to realize ultra high-speed, large-capacity communications by realizing millimeter wave and MIMO (Multiple Input Multiple Output) transmission. Since the wavelength at 151.5~164 GHz is 1.9 mm, small antennas of 1 mm or less can be formed, and modules with multi-element antennas with a pitch of 1 mm or less can be realized. The challenges for MIMO antenna modules are the increase in wiring paths due to the increase in the number of elements and the increase in transmission loss due to the routing of wiring paths. In this paper, we investigated laminating low-k dielectric resin using the latest printed circuit board technology and fabricated a prototype AiP with excellent mass production performance. The package size is 8.42mm x 20mm x >1mmt and can be mounted on multiple wearable devices.
This work was supported in part by the Ministry of Internal Affairs and Communications, Japan, under Grant JPJ000254, and this conference presentation was co-authored by Institute of Science Tokyo and National Institute of Information and Communications Technology (NICT).

Award Recipient

Hiroshi Taneda
Process Development Dept., Research & Development Div. 
Shinko Electric Industries Co., Ltd.