SHINKO ELECTRIC INDUSTRIES CO., LTD. Received IEEE EPS Japan Chapter Young Award, at ICEP-IAAC 2025

SHINKO ELECTRIC INDUSTRIES CO., LTD. hereby announced that our presentation at the ICEP（International Conference on Electronics Packaging）-IAAC（iMPAS Al Asia Conference）2025, held in Nagano-shi, Nagano, Japan last April, was awarded the "IEEE EPS Japan Chapter Young Award," and the award ceremony was held at the ICEP-HBS 2026 in Hiroshima-shi, Hiroshima, Japan on April 15th of this year.
This honor reflects the high recognition of our research on both low inductance and high-power density by leveraging the proprietary structural features of POL (Power Overlay).

Title of Conference Presentation

Lower inductance of POL double layer facing structure power module

Abstract for a Conference Presentation

In recent years, with the widespread adoption of electric vehicles (EVs), there has been rapid progress in increasing the power density and efficiency of power conversion devices, and consequently, reducing the inductance of power modules has become an important issue. To develop a low-inductance power module, we designed a structure in which two POLs are not arranged in parallel but instead have their wiring surfaces facing each other. In the conventional structure, the parasitic inductance was 23.6 nH; however, it was confirmed that this structure significantly reduces it to 8.7 nH. Furthermore, simulations revealed that reducing the distance between the wiring layers to 1 mm enables further reduction of the parasitic inductance of the power module to 5.5 nH.
This conference presentation included results from joint research conducted in collaboration with Tohoku University.

Award Recipient

Takumi Yumoto
Products Development Dept., Research & Development Div. 
Shinko Electric Industries Co., Ltd.