SHINKO is developing and manufacturing a variety of leadframes, such as stamping leadframes with 256 pins; multilayered (advanced) lead frames with superior heat-dissipation properties; and Plastic Very Thin Quad Flat Non-leaded(P-VQFN).
We are also developing super fine-pitch, matrix, and deep downset lead frames.
SHINKO strives to improve package development and manufacturing from many perspectives. For example, we are promoting the use of a lead-free palladium plating process, which will contribute toward protecting the global environment.
(Super Fine Pitch Stamped Leadframe)
|By placing an inner lead close to the IC chip made possible for stabilized production of IC packaging and a significant cost reduction.|
|Enhanced thermal performance Leadframe||An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation|
(Plastic Very Thin Quad Flat Non-leaded)
|A CSP built applying leadframe processing technology|
(Palladium Pre Plated Leadframe)
|Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the leadframe.|
|Open Tool||Shorter delivery times due to the use of open tools.|