SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

IC Package

Leadframe

leadframe

SHINKO is developing and manufacturing a variety of leadframes, such as stamping leadframes with 256 pins; multilayered (advanced) lead frames with superior heat-dissipation properties; and Plastic Very Thin Quad Flat Non-leaded(P-VQFN).
We are also developing super fine-pitch, matrix, and deep downset lead frames.
SHINKO strives to improve package development and manufacturing from many perspectives. For example, we are promoting the use of a lead-free palladium plating process, which will contribute toward protecting the global environment.

Product name Concept
SFP-LF
(Super Fine Pitch Stamped Leadframe)
By placing an inner lead close to the IC chip made possible for stabilized production of IC packaging and a significant cost reduction.
Enhanced thermal performance Leadframe An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation
P-VQFN
(Plastic Very Thin Quad Flat Non-leaded)
A CSP built applying leadframe processing technology
Pd-P.P.F
(Palladium Pre Plated Leadframe)
Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the leadframe.
Open Tool Shorter delivery times due to the use of open tools.

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