SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

IC Package

Lead Frame

lead frame

The increase in IC size and the development of advanced chip functions have placed new demands on improving the thermal dissipation and electrical properties of semiconductor packages. To meet these new demands, SHINKO is developing and manufacturing a variety of lead frames, such as stamping lead frames with 256 pins; etching lead frames, suitable for quick delivery requirements; multilayered (advanced) lead frames with superior heat-dissipation properties; and leads on chips (LOC*) for memory purposes. We are also developing super fine-pitch, matrix, and deep downset lead frames. SHINKO strives to improve package development and manufacturing from many perspectives. For example, we are promoting the use of a lead-free palladium plating process, which will contribute toward protecting the global environment.
*LOC: A lead frame extended onto the IC and wire-bonded in the center of the chip

Single-layer lead frames High-performance lead frames
Surface mount
(4 sides)
Surface mount
(2 sides)
Through hole
QFP
-LQFP
-TQFP
QFJ(PLCC)
QFI
QFN
SOP
-SSOP
-TSOP
-TSSOP
SOJ
SOI
SON
LOC
COL
DIP
-Standard
-Shrink DIP
-Skinny DIP
-IDF
SIP
ZIP
DHS QFP
DPH QFP
Product name Concept
Multilayer Lead Frame An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation
P-VQFN
(Plastic Very Thin Quad Flat Non-leaded)
A CSP built applying lead frame processing technology
Rivetting A high-heat-dissipating package where the heat spreader is attached to the single-layered lead frame by riveting, and the heat spreader is designed so that it is exposed outside the package.
Pd-P.P.F
(Palladium Pre Plated Lead Frame)
Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the lead frame.
SFP-LF
(Super Fine Pitch Stamped Lead Frame)
By placing an inner lead close to the IC chip made possible for stabilized production of IC packaging and a significant cost reduction.
Open Tool Shorter delivery times due to the use of open tools.

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