Device Embedded Package [MCeP®]

Back : BGA , Surface : SMD(Surface Mount Device)

We offer MCeP®(Molded Core embedded Package) with the package structure achieved by active and passive components built in.
The package type is also called "embedded substrate" in the market.
We provide the package features compact and thin package size, excellent electric characteristics, and high reliability enabled by our own packaging technology.

Concept |
Features |
Structure |
Uses |

Concept

Silicon chip ( Passives) embedded package structure

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Features

Consisted of only assembly process ( High yield and Short TAT compared with substrate build up type)
Fine Pitch Flip Chip connection by Au - Solder
Electrical and Mechanical connection between Sub and Base substrate by Cu core solder ball
Flat, low warpage package with high reliability by mold resin encapsulation
Small size and Low height

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Structure

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Uses

Substitution of PoP ( Package on Package )
Substitution of SiP ( System in Package)
Small Modules

*MCeP® ( Molded Core embedded Package ) is the registered trademark of SHINKO ELECTRIC IDUSTRIES CO.,LTD.

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