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IC Package/ Build-up Substrate
DLL® (Direct Laser & Lamination)
- Build-up Substrate with Flip Chip interconnection
- High wiring density & high performance IC package
- Produced by Direct Laser & Lamination (DLL®) Process
- CO2 gas laser is used for blind via forming
- Semi-additive process is applied for build-up layer
- Enhanced electrical performance by multi-layer structure
- Applied green materials
- Total package support such as substrate design, substrate manufacturing and IC assembly
- In devices such as MPUs and ASICs for which high-density routing is required
- Build-up thermo-set organic film
- Easy to control the insulator thickness
- Various insulator thickness are available (30~50um)
- Good uniformity of insulator thickness
- Good insulation due to thermo-set material
- CO2 Laser drilling
- Micro blind via increase the design flexibility and wiring density
- CO2 Laser drilling process is simple process rather than photo via process
- Good capability of via diameter
- FC Pad
- Available pre-soldering and Ni/Au plating for surface finish
- Both SMD,NSMD applicable
- Via on pad structure
- PTH cap plating
- Plated via on PTH structure can be formed
- Semi additive patterning
- The routing density is increased by semi additive process
- Good via reliability and adhesion of trace can be obtained by optimized process condition
*DLL® is the registered trademark of SHINKO ELECTRIC INDUSTRIES CO.,LTD.