Features of Research and Development

SHINKO is conducting research and development projects to meet customers’ needs for the future.
SHINKO offers world-leading semiconductor package technology by starting with the development of electronic materials with superior thermal, mechanical, and electrical characteristics, then combining them with various underlying technologies such as plating technology, precision processing technology and lamination technology, etc.

A Development Framework that Satisfies Market and Customer Needs Quickly

SHINKO R&D Center, which is our research and development base, is accumulating material and process development and basic research from various viewpoints of electricity, physics, chemistry, and other fundamental sciences. Furthermore, SHINKO R&D center has been accumulating design, simulation, evaluation, analysis, and analytical technology for accelerating our development and productization.

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Fundamental Research

To produce semiconductor packages offering higher performance and improved interconnect technology, SHINKO conducts fundamental research from various viewpoints such as electrical, physical, and chemical studies.

Development of Materials and Processes

As IC chips become widely used, the development of new semiconductor package materials is becoming indispensable. From this viewpoint, SHINKO is proactively developing new materials with superior thermal, mechanical, and electrical characteristics such as high heat resistant insulating resin materials, and semiconductor packages to take advantage of IC chips’ performance.

Evaluation and Analysis/Analytical Laboratory

To take advantage of the characteristics of a material, it is necessary to apply effective technologies to analyze and evaluate it. SHINKO has cutting-edge analysis equipment such as EPMA, SEM, FIB-SEM, EBSD, XRD (X-ray diffractometer), and network analyzers for evaluating electrical characteristics, and transient thermal measurement systems for evaluating thermal characteristics.

Design and Simulation Technology

By using thermal, mechanical, and electrical simulation technologies in product design and development, we are improving the degree of completion of designs ranging from structural design at the initial stage to wiring design, making it possible to shorten the development period, reduce cost, and improve reliability. Therefore, SHINKO offers the optimized interconnect technology solutions to customers. Furthermore, we endeavor to propose the best solution by promoting improved design and analysis technology through feedback from actual measurements and results.