Research & Development
This technology has been used since our company was founded, first applied to recycling household lightbulbs. Technology that joins metal, glass, and more while maintaining air tightness is used in products that require a high degree of hermetic sealing and resistance to high temperatures.
This technology turns ceramic powder into a paste and hardens it into a variety of shapes. Metal pattern wiring and drilling on ceramics are available at our company. While this technology was used for manufacturing semiconductor packages, at present, they are also used for manufacturing the core parts (ceramic electro static chucks) of semiconductor manufacturing equipment.
This technology is used to produce substrates with multilayer wiring. With our fine-wiring forming technology and mass-production capacity, we support the evolution of advanced semiconductors.
Our technology assembles various types of semiconductor devices. We have the technology for wafer thinning, electrically connecting IC chips to substrates, and molding with dedicated material to protect the IC chips from external environment.
We have the technology for stamping and drawing materials with high precision, and use it to produce various types of dies and precision parts.
Our high-precision plating technology applies to various materials used in semiconductor packages. The resulting materials gain characteristics required for semiconductor packages, such as electrical connectivity and corrosion resistance properties.
We have the technology for processing plastic materials mechanically, chemically, physically, and thermally. This is an important technology for making semiconductor packages smaller, thinner, and lightweight.
Photolithography is a fine-wiring forming technology based on photographic development technology. Etching is a metal melting technology using corrosive action of chemical agents. With this high-precision technology, we can form electric circuits thinner than the width of a human hair.