SHINKO ELECTRIC INDUSTRIES CO., LTD.
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Substrate
*i-THOP (integrated Thin film High density Organic Package).
i-THOP is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.
Due to increasing demands of chiplets, and logic and HBM (High Bandwidth Memory) interface on semiconductor package designs such as advanced CPU and GPU, integrating interposers have become mainstream on 2.5D structures.
SHINKO has developed ultra-high-density organic substrate, “i-THOP®”, that has the equivalent function as that of 2.5D package.
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