Under Development

i-THOP®

i-THOP®(integrated Thin film High density Organic Package)

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Features

  • Realization of high density interconnection on organic package, integrating interposer on package substrate.
  • To form ultra fine wiring layers by applying thin film technology to interposer.
  • Usable to chip split, chip partition and wideband memory connection are available for system integration.
  • 2.1D type and 2.3D type, depending on applications.

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Structure

2.1D type i-THOP®

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Thin film area size

Build-up substrate area = Package area

Thin film fromation

On bulid-up substrate

Joint method with build-up substrate

Via(Cu plating)

2.3D type i-THOP®

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Thin film area size

Chip area

Thin film fromation

On core-less substrate

Joint method with build-up substrate

Solder

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Design

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Target Areas & Status

  • 2.1D / 2.3D organic package replacing 2.5D solution with Si interposer

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* i-THOP and DLL are either registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

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