SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

Packaging / System in Package

Stacked-FBGA (MCP)

Concept

  • A multi-chip package with ICs stacked on the substrate

Features

  • A small, light F-BGA, close to chip size.
  • Package size can be chosen, as it is possible to adjust the size of the external mold by sawing.
  • Fine-pitch routing on the substrate enables cost reduction.
  • The interposer board can be either a laminate or tape substrate.
  • We offer total support from the design and manufacture of the interposer board to assembly and test.
  • Multi chip stacked package is available for mass production. (More than 7 chip stacked package is available presently).
  • F/C + W/B type (chip connected by wire bonding on chip connected by Flip Chip). is available for mass production.

Structure

Stacked-FBGA

 

Stacked-FBGA

Uses

  • Low Power , Memory / ASIC
  • Memory + Memory
  • Logic + Memory
  • Logic + Analog
  • Logic + Logic

Package Support Range

Min. Wire Bonding Chip Pad Pitch (Inline)30um
Min. Flip Chip Pad pitch (Peripheral)35um
Chip Thickness (W/B) [300mmøwf]30um
Min. Chip Thickness (FC) [300mmøwf]40um
Package Size 3 - 21mmSQ
Package Ball Pitch< 0.4mm

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