SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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Packaging / System in Package

PoP (Package on Package)

Concept

  • Stackable package structure

Features

  • Different package combinations are available by stackable package structure
  • Individual package testing is available and high yield is expected
  • Smaller area after mounting on the board
  • Valuable chip connection as wire bonding and flip chip
  • Thinner chip using flip chip technology achieve fine pitch intermediate connection
  • Chip stack technology at bottom package
  • Top and bottom package assembly technology

Structure

PoP

Uses

  • Low Power Memory / ASIC
  • Logic + Memory
  • Logic + Logic

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