Substrate

Plastic BGA Thin Substrate (Coreless Substrate)

Introduction

SHINKO supplies coreless substrates which are thin build-up substrates made by removing a core layer for memory or others use in sophisticated small electronic devices such as smartphones.

Features

  • Ultimate substrate thickness reduction is possible
  • Superior electrical characteristics
  • Available for both WB (Wire Bonding) and FC (Flip-Chip)
  • Multilayer structure consisting of 3 or more layers is possible
  • High density is possible by using semi-additive process and laser vias
  • Etch back process is supported

Structure

3層コアレス基板.png

Applications

  • Memory
  • Logic
  • RF devices, etc.

Technical Document (Download)

Substrate

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PBGA Substrate

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Click on download the PDF file and view details.