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IC Package/ P-BGA Substrate

IVH 3(Coreless Substrate )

Concept

  • The coreless substrates realize the thinner thickness by removing the core layer

Features

  • Optimization of substrate design considering electrical performance
  • High density wiring by Semi-additive process and interstitial Via (Laser)
  • The multilayer structure of more than three layers is possible
  • This superlative thinner substrates are achieved by removing the core layer
  • Etch back process
  • Available both for Flip-chip & Wire bonding
  • The total support from designing to substrate assembling is possible

Structure

Structure

Application

  • Chip sets, memory and ASICs

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