SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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IC Package/ P-BGA Substrate

IVH (Build-up Substrate with core)

Concept

  • Build-up substrates to achieve higher pin count and high density substrate or smaller substrate(CSP), in strip form

Features

  • Optimization of substrate design considering electrical performance
  • High density wiring by Semi-additive process and interstitial Via (Laser)
  • The multilayer structure of more than three layers is possible
  • Available thinner substrate by using thin core
  • Etch back process
  • Available both for Flip-chip & Wire bonding
  • The total support from designing to substrate assembling is possible

Structure

Structure

Application

  • Chip sets, controller, memory, ASICs, module and image sensor

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