SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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IC Package/ P-BGA Substrate

2 Layer / 4 Layer Substrate with through hole

Concept

  • 2 Layer/4 Layer substrates to achieve higher pin count and/or smaller substrate(CSP), in strip form

Features

  • Lower cost
  • High reliability substrate application is possible
  • Optimization of substrate design considering electrical performance
  • High density wiring by Semi-additive process
  • Available thinner substrate by using thin core
  • Etch back process
  • Available both for Flip-chip & Wire bonding
  • The total support from designing to substrate assembling is possible

Structure

Structure

Application

  • Chip sets, controller, memory and ASICs
  • Automotive devices which require high reliability

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