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IC Package / Leadframe

SFP-LF (Super Fine Pitch Stamped Leadframe)

Concept

  • By placing an inner lead close to IC chip made possible for stabilized production of IC packaging and a significant amount of cost reduction.

Features

  • These leadframes can be used even for small chip ICs
  • A large cost reduction is enabled by the use of the stamping method, which lends itself to mass production
  • Wire can be saved.
    • Wire short defects are greatly reduced by using the resin-sealing process
    • Electrical characteristics is improved by lowered electrical resistance
    • Bringing down wire material costs
SFP-LF
216pin LQFP(24X24mm 0.4P), Inner lead pitch:110um, Material:Copper alloy 0.127mm t

SFP Stamped Leadframe Assembly Effect

SFP-LF
216pin LQFP Inner lead pitch 150um, 130um, 110um

Inner lead pitchWire length reduction/leadWire length reduction/unit
150um -> 130um0.54mm118mm
150um -> 110um1.39mm300mm

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