SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

IC Package / Leadframe

Pd-P.P.F. (Palladium Pre Plated Leadframe)

Concept

  • Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the leadframe.
  • Solder processing at IC assembly is not required therefore it becomes possible to reduce assembly cost.
  • Lead, which is potentially damaging to the environment, is not produced.

Features

Pd-P.P.F.

Structure

Pd-P.P.F.

    *Regarding the thickness of nickel-plating, SHINKO provides solutions to your requirements considering lead processing.

    *Regarding the thickness of palladium plating, SHINKO provides solutions to your requirements considering cost and performance characteristics.
    For each plating specification, SHINKO supports with our own high quality control.

Lineup

  • Three-layered palladium plated products applied with gold flash. (recommended specification)
    • Stability of wire bonding, having the same assembly characteristics to the conventional product of solder plating.
  • OPTION
    • Thin-Layer Palladium Pre-Plated Frame (TL-Pd P.P.F.): VE specification, due to reduction of thickness of Palladium plating.
    • (TN-Pd P.P.F.): Improving the high temperature reflow characteristics by micro rough surface processing.

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