SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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IC Package / Leadframe

P-VQFN (Plastic Very Thin Quad Flat Non-leaded)

Concept

  • A CSP built applying lead frame processing technology
QFN 1 QFN 2

Features

  • Mounting area has been reduced approximately 40% (compared with SSOP 16/24 pins)
  • Supports tape bonding of lead frame MAP TYPE P-VQFN
  • Lead-free(Pd plating)
  • High accuracy Ag plating
  • Micro rough surface for HIGH RELIABILITY package

Structure

Individual Type

  • Each package is individually molded, and then removed from the mold by shaking it out

Cross section

Individual Type

Design layout

Individual Type

Map Type

  • A number of packages are molded together in each cavity, and the individual packages are then cut out

Cross section

Map Type

Design layout

Map Type

Uses

  • In high-frequency devices for mobile phone and PCs

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