SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

Components

RF Ceramic Package

Concept

  • Easy-to-use and high performance solutions
  • Suitable for high speed signal propagation

Features

  • Rectangular coaxial structure to achieve impedance matching and good isolation
  • Virtual-GND with outer-to-inner lead pitch conversion structure

Top Lead Type

  • Adoption of SHINKO original transmission mode conversion method to reduce losses

Bottom Lead Type

  • Characteristic impedance matching on Z-direction by VIA-CPW structure which makes it possible to attain low propagation loss
  • Excellent transmission characteristics by reduction of package size

Structure

  • Top Lead Type with standard pitch
  • Bottom Lead Type available for surface-mount
  • Heat Slug Attachment for thermal dissipation
    Structure

Applications

  • LD Driver
  • PD Preamp
  • MUX
  • DEMUX
  • Module Package etc.

Detailed data

Top Lead Type

Top Lead Type

Top Lead Type

Bottom Lead Type

Bottom Lead Type

Bottom Lead Type

Other guidance

  • Metal lid (Au/Sn) is optional
  • Additional mtal ring for seam welding is also available
  • Torque driver and box bit for connector are also available

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