SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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Components / Ceramic Package

Metal Wall Package

Concept

  • Lends itself to the combination of various materials for various required speeds of communication
  • We offer and design structures and layouts that best suit the application of the device
  • We propose the best frame and materials while trying to realize low costs

Features

  • Up to 40Gbps
  • Hermeticity : 1x10-9 Pa.m3/sec

Structure

  • An input/output feed through using ceramic, glass, and coaxial connector
  • Low costs realized by using hard glass for the communications window
  • Costs can be reduced by using pipes, bending, insertion frames or metal injection molds(MIMs)
  • Improved heat-dissipation through the use of CuW or Cu/Mo bases
Metal Wall Package

Uses

  • A package for optical communications devices
  • In active devices, such as laser diodes for communication, pump lasers, photo diodes

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