Invitation to our booth SEMICON Japan 2018

SEMICON Japan 2018 will be held from December 12th through 14th, 2018 at Tokyo Big Site.
SHINKO will introduce the advanced solutions.
We are looking forward to seeing you at our booth.

Date & Time
December 12th (Wed) - 14th (Fri), 2018
10:00 - 17:00

Venue

Tokyo Big Site

Organizer

SEMI

Official Website

http://www.semiconjapan.org/en/home

Main exhibition products

· POL (Power Overlay)
· i-THOP® (integrated Thin film High density Organic Package)
· WSM (Wireless Sensor Module)
· MLHP (Micro Loop Heat Pipe)

Booth #

East Hall 3, No.3338
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