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Packaging / System in Package
PoP (Package on Package)
- Stackable package structure
- Different package combinations are available by stackable package structure
- Individual package testing is available and high yield is expected
- Smaller area after mounting on the board
- Valuable chip connection as wire bonding and flip chip
- Thinner chip using flip chip technology achieve fine pitch intermediate connection
- Chip stack technology at bottom package
- Top and bottom package assembly technology
- Low Power Memory / ASIC
- Logic + Memory
- Logic + Logic