Rigid Substrate [P-BGA Substrate]

The Plastic-BGA substrate is mainly used for memory, controller, and chipsets, and they are characterized in the RIGID substrate with Through Hole and also supplied by strip form.
To meet customer's needs of smaller and thinner as a substrate for a Mobile device, we applied "Semi-additive process" in addition to "subtractive process" for such market needs.
Moreover, to meet the demand of "high speed signal integrity", the total support from design to production, including simulation is being offered.

Concept |
Features |
Structure |
Applications |
Package Type

Concept

Surface mount packages which use PCB'S to achieve higher pin count and smaller package form-factor and high I/O density, in strip form.

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Features

Optimization of substrate design considering thermal and electrical performance
Finer ball pitch and thinner package thickness
High electrical performance due to short wire length
Etch back process
Available both for Flip-chip & Wire bonding
High density wiring by Semi-additive process
By using laser drilling process, 4Layer substrates with an IVH structure is possible

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Structure

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Applications

In chip sets, controller, memory, and ASIC'S.

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Package Type

Matrix Type

Minimized P-BGA as Chip Scale Package (CSP).
Cost saving through utilization of conventional assembly line can be offered by use of common molding tool.

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Center Pad Type

Suitable package for high speed DRAM such as DDR series.
Total support including die attach taping.

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Build-up Type

Fine Pitch Trace
- >> Semi-additive process can be optional for internal and external layer.
Build-up integrated in
- >>4 Layer.(Standard) : L1-L2 , L2-L3 , L3-L4 in Z-plane.
- >>6 Layer(Option) : L1-L2 , L2-L3 , L3-L4 , L4-L5 , L5-L6 in Z-plane.
Low Cost Solution
- >> High density structure by simplified process.
Over Molding
- >> No process change is expected
Available both in FC & Wire bonding

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