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Packaging / Module assembly
Module assembly
- Small high performance module with great variety of assembly technology
- Total support from design, and assembly through testing
- Various chip connection technology (wire bonding, flipchip and chip stack) and small package assembly technology(WLP)
- High density mount technology of small passive component and connector
- Module design availability for radio frequency
- All parts including passive components can be sealed into one mold which is able to be handled as a typical semiconductor package.
- Cell phone , digital still camera , super small and high density products
- Wafer , bare die handling
- Variable connection technology such as wire bonding, flipchip, chip stack
- Small passive component mount such as 0603(0.6x0.3mm)