HOME
Contact Us
Sitemap
IC Package / Lead Frame
SFP-LF (Super Fine Pitch Stamped Lead Frame)
- By placing an inner lead close to IC chip made possible for stabilized production of IC packaging and a significant amount of cost reduction.
- A pioneering mass-production solution for super fine-pitched lead frames with an inner lead pitch of 128um
- These lead frames can be used even for small chip ICs
- A large cost reduction is enabled by the use of the stamping method, which lends itself to mass production
- Gold wire can be saved, bringing down gold-wire material costs
- Gold-wire short defects are greatly reduced by using the resin-sealing process
- Electrical characteristics is improved by lowered electrical resistance
SFP Stamped Lead Frame Assembly Effect
(Package:QFP208PIN, Chip Size:4.0mmSQ)
| Inner Lead Pitch | 170um | 128um | Difference |
|---|---|---|---|
| Wire Length/Lead | 4.5mm | 2.9mm | 1.6mm |
| Wire Length/Unit | 936mm | 603.2mm | 332.8mm |
