Pd-P.P.F. (Palladium Pre Plated Lead Frame)

Concept |
Features |
Structure |
Lineup

Concept

Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the lead frame.
Solder processing at IC assembly is not required therefore it becomes possible to reduce assembly cost.
Lead, which is potentially damaging to the environment, is not produced.

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Features

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Structure

*Regarding the thickness of nickel-plating, SHINKO provides solutions to your requirements considering lead processing.

*Regarding the thickness of palladium plating, SHINKO provides solutions to your requirements considering cost and performance characteristics.
For each plating specification, SHINKO supports with our own high quality control.

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Lineup

Three-layered palladium plated products applied with gold flash. (recommended specification)
- Stability of wire bonding, having the same assembly characteristics to the conventional product of solder plating.
OPTION
- Thin-Layer Palladium Pre-Plated Frame (TL-Pd P.P.F.): VE specification, due to reduction of thickness of Palladium plating.
- (TN-Pd P.P.F.): Improving the high temperature reflow characteristics by micro rough surface processing.

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