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IC Package / Lead Frame
P-VQFN (Plastic Very Thin Quad Flat Non-leaded)
- A CSP built applying lead frame processing technology
- A high-frequency supporting package built using lead frame materials
- Mounting area has been reduced approximately 40% (compared with SSOP 16/24 pins)
- A thin CSP with maximum package installation height of 0.8mm
- Supports tape bonding of lead frame MAP TYPE P-VQFN
- Lead-free(Pd plating)
