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IC Package / Lead Frame
Multilayer Lead Frame
- Concept |
- Package Type |
- Uses
- An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation
DHS QFP (Drop in Heat Spreader QFP)
- Offers a choice between a built in or exposed heat spreader, depending on cost and thermal characteristics
- The built in heat-spreader type supports a 2 to 2.5 watt chip (28mmSQ QFP)
- The exposed heat-spreader type is attached to the surface of the package and supports a 2.5 to 3 watt chip (28mmSQ QFP)
- The fusion of the heat spreader and the lead frame has resulted in lower thermal resistance
- The wire-bonded single-layered lead frame amalgamated with a separate heat spreader at the time of molding
DPH QFP (Die Pad Heat Spreader QFP)
- A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the lead frame
- Supports a 2.5 watt chip (28mm SQ QFP)
- The lead frame can be made of a strong copper alloy, while the heat spreader can be made of an alloy with good thermal conduction properties, making it possible to have different materials in the same package
- Electrical properties are improved by electrically connecting the heat spreader to the power source or the grounding lead
- By changing the wire bond conditions, the assembly process of the conventional single-layer lead frame can be used without alternations
- A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the lead frame. (Type A)
- Heat spreader functions as the power source or ground plane by attaching a projection around the heat spreader and electrically connect to the power source or the ground lead. (Type B)
E-DPH QFP (Exposed Die Pad Heat Spreader QFP)
- A high-heat-dissipating package where the heat spreader is attached to the single-layered lead frame by tape, and the heat spreader is designed so that it is exposed outside the package
- Supports a 2.5 to 3 watt chip. By attaching another heat-dissipating fin, a 3.0 to 3.5 watt chip can be supported (28mmSQ QFP)
- A two-layered lead frame in which the heat spreader is attached to the lower surface of a die pad-less lead frame with double-sided adhesive tape
- The thickness of the heat spreader is designed so as to expose it on the package after the mold has been formed
- Particularly suited for devices that require superior thermal dissipation
- E.g., PCs, ASICs, DSPs and high-speed microprocessors