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IC Package / Lead Frame
Rivetting
- An efficient heat diffuser suited particularly for superior thermal dissipation requirements.
- A high-heat-dissipating package where the heat spreader is attached to the single-layered lead frame by riveting, and the heat spreader is designed so that it is exposed outside the package.
- In combination of plating with high adhesiveness to the mold plastic, it is employed in high reliability package for cars.
- A two-layered lead frame having a connecting point for the lead frame without a die pad and a heat spreader is attached to the lead frame at the riveting portion.
- The thickness of the heat spreader is designed so as to expose it on the package after the mold has been formed.
- Suited for devices with superior heat-dissipation requirements
- E.g., car electronic devices, and high-speed microprocessors