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IC Package
Lead Frame
The increase in IC size and the development of advanced chip functions have
placed new demands on improving the thermal dissipation and electrical properties
of semiconductor packages. To meet these new demands, SHINKO is developing
and manufacturing a variety of lead frames, such as stamping lead frames with
256 pins; etching lead frames, suitable for quick delivery requirements; multilayered
(advanced) lead frames with superior heat-dissipation properties; and leads
on chips (LOC*) for memory purposes. We are also developing super fine-pitch,
matrix, and deep downset lead frames. SHINKO strives to improve package development
and manufacturing from many perspectives. For example, we are promoting the
use of a lead-free palladium plating process, which will contribute toward
protecting the global environment.
*LOC: A lead frame extended onto the IC and wire-bonded in the center
of the chip
| Single-layer lead frames | High-performance lead frames | ||
|---|---|---|---|
| Surface mount (4 sides) |
Surface mount (2 sides) |
Through hole | |
| QFP -LQFP -TQFP QFJ(PLCC) QFI QFN |
SOP -SSOP -TSOP -TSSOP SOJ SOI SON LOC COL |
DIP -Standard -Shrink DIP -Skinny DIP -IDF SIP ZIP |
DHS QFP DPH QFP |
| Product name | Concept |
|---|---|
 Multilayer Lead Frame |
An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation |
| P-VQFN (Plastic Very Thin Quad Flat Non-leaded) |
A CSP built applying lead frame processing technology |
| Rivetting |
A high-heat-dissipating package where the heat spreader is attached to the single-layered lead frame by riveting, and the heat spreader is designed so that it is exposed outside the package. |
| Pd-P.P.F (Palladium Pre Plated Lead Frame) |
Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the lead frame. |
| SFP-LF (Super Fine Pitch Stamped Lead Frame) |
By placing an inner lead close to the IC chip made possible for stabilized production of IC packaging and a significant cost reduction. |
| Open
Tool |
Shorter delivery times due to the use of open tools. |