Flexible Substrate [Tape BGA]

With mobile devices and personal digital assistants (PDAs) becoming increasingly smaller, thinner, lighter and more advanced, packages for such applications are also required to support miniaturization, low profiling, lightness, and high levels of integration. Tape-BGA is the chosen CSP for such market needs. The Tape-BGA, with its polyimide base, realizes miniaturization, low profiling, lightness, and high-density routing.

Concept |
Features |
Structure |
Applications

Concept

A polyimide substrate that can attain small sizes, thinness and fine-pitches

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Features

Thickness can be reduced
Miniaturization and reduced weight is possible
Applicable 0.5mm pitch solder ball
Reel-to-reel production method enables mass production, realizing lower costs
Via holes are drilled using the expertise of stamping technology gained from leadframe packaging
The most suitable packaging method is selected, for the basis of prototyping, volume production, and product specifications

Cross-section of Copper plug via

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Structure

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Applications

In mobile devices that require compactness and lightness
In various devices such as DSPs

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