HOME
Contact Us
Sitemap
Components
RF Ceramic Package
- Easy-to-use and high performance solutions
- Suitable for high speed signal propagation
- Rectangular coaxial structure to achieve impedance matching and good isolation
- Virtual-GND with outer-to-inner lead pitch conversion structure
- Adoption of SHINKO original transmission mode conversion method to reduce losses
- Characteristic impedance matching on Z-direction by VIA-CPW structure which makes it possible to attain low propagation loss
- Excellent transmission characteristics by reduction of package size
- Top Lead Type with standard pitch
- Bottom Lead Type available for surface-mount
- Heat Slug Attachment for thermal dissipation
- LD Driver
- PD Preamp
- MUX
- DEMUX
- Module Package etc.
Top Lead Type
Bottom Lead Type
- Metal lid (Au/Sn) is optional
- Additional mtal ring for seam welding is also available
- Torque driver and box bit for connector are also available