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IC Package
Build-up Substrate
Build-up Substrates produced by Direct Laser & Lamination (DLL®) Process features the achievement of high-speed and high-density, and its demand is becoming greater owing to the recent performance improvement of electronic appliances. We, SHINKO, can come up with such requirements by providing Build-up Substrate which has the excellent features of fine line pattern by semi additive process, multi-layer structure, and excellent electric characteristics and design flexibility by stacked via structure. We will also focus on the development of the next generation package that enables greater features of high-speed, high-density, compactness and thin package size required by the market in future.
- Build up Substrate with Flip Chip interconnection
- High wiring density & high performance IC package
- Produced by Direct Laser & Lamination (DLL®) Process
- CO2 gas laser is used for blind via forming
- Semi-additive process is applied for built-up layer
- Enhanced electrical performance by multi-layer structure
- All Halogen free materials will be used
- Total package support such as substrate design, substrate manufacturing and IC assembly
- In devices such as MPUs and ASICs for which high-density routing is required
- Build up thermo-set organic film
- Easy to control the insulator thickness
- Various insulator thickness are available (30~50um)
- Good uniformity of insulator thickness
- Good insulation due to thermo-set material
- CO2 Laser drilling
- Micro blind via increase the design flexibility and wiring density
- CO2 Laser drilling process is simple process rather than photo via process
- Good capability of via diameter
- FC Pad
- Available pre-soldering and Ni/Au plating for surface finish
- Both SMD,NSMD applicable
- Via on pad structure
- PTH cap plating
- Plated via on PTH structure can be formed
- Semi additive patterning
- The routing density is increased by semi additive process
- Good via reliability and adhesion of trace can be obtained by optimized process condition
*DLL® is the registered trademark of SHINKO ELECTRIC INDUSTRIES CO.,LTD.
