Invitation to our booth 18th IC Packaging Technology Expo.

18th IC Packaging Technology Expo will be held from January 18th through 20th, 2017 at Tokyo Big Site.
SHINKO inform the solutions for IoT & Power.
We are looking forward to seeing you at our booth.

Date & Time
January 18th (Wed) - 20th(Fri), 2017
10:00 - 18:00 (20th:10:00 - 17:00)

Venue

Tokyo Big Site

Organizer

Reed Exhibitions Japan Ltd.

Official Website

http://www.icp-expo.jp/en/

exhibition products

[IoT Solutions]
· 3D Die Stacking
· Die Embedded + RDL
· ETS (Embedded Trace Substrate)
· Glass Package
· i-THOP® (integrated Thin film High density Organic Package)
· MCeP® (Molded Core embedded Package)
· WSM (Wireless Sensor Module), Health Patch

[Power Solutions]
· HS + CNT-TIM
· MLHP (Micro Loop Heat Pipe)
· POL (Power Overlay)

Booth #

West Hall 1, W5-42
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