Invitation to our booth 13th IC Packaging Technology Expo.

The 13th annual IC Packaging Technology Expo, will be held from January 18th through 20th, 2012 at Tokyo Big Site.
At the exhibition, we will introduce our "Coreless Substrate" and other new technologies.
We are looking forward to seeing you at our booth.

Date & Time
January 18th (Wed)-20th(Fri), 2012
10:00-18:00 (20th:10:00-17:00)

Place

West Hall 4, Tokyo Big Site

Organizer

Reed Exhibitions Japan Ltd.

Official Website

http://www.icp-expo.jp/en/

exhibition products

Coreless Substrate DLL3,
Coreless IVH Substrate IVH3,
Miniature Wireless Sensor Module,
Micro Spring Interconnect Technology

Booth #

West 4 - 1
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