Simulation technology

Thermal & Mechanical Characteristics

Analysis	Application	Software
Thermal Resistance Analysis	For simulating the thermal resistance of a package	COSMOS/M (STRUCTURAL RESEARCH & ANALYSIS) FLOTHERM (FLOMERICS)
Thermal Stress Analysis	Warpage and internal stress simulation for packages under temperature cycle test and assembly process Fatigue life prediction of solder joint	ABAQUS(ABAQUS) ANSYS/LS-DYNA(ANSYS)

Analysis	Application	Software
2D Analysis of LCRZo	Extraction of 2D cross-section resistance, inductance, and capacitance Calculation of characteristic impedance Calculation of differential characteristic impedance Creation of a SPICE sub-circuit	A2D Extractor (Ansoft) Apsim LCR (Apsim)
Analysis of 3D LCR	Extraction of inductance, resistance, and capacitance of packages	Q3D Extractor (Ansoft) Turbo Package Analyzer (Ansoft) PakSi-E (Optimal)
EMI Analysis	Calculation of electromagnetic interference of packages	Speed2000 (Sigrity) Apsim RADIA (Apsim)
S-Parameter Analysis	Calculation of the S-Parameter Calculation of insertion and return losses Calculation of characteristic impedance Data output in Touchstone and City formats	HFSS (Ansoft) PowerSI (Sigrity) Designer (Ansoft) ADS (Agilent)
Waveform Analysis	Signal waveform analysis Cross-talk analysis Simultaneous switching noise analysis Analysis of waveforms using S-Parameter	HSPICE (Synopsys) Speed2000 (Sigrity) Designer (Ansoft) ADS (Agilent)